Future Intel CPUs could be cobbled together using different parts


Today’s processors, made using a single continuous slab of silicon, may soon give way to multiple chips interconnected at high speeds, Intel said Tuesday morning.

Intel said its new Embedded Multi-die Interconnect Bridge, or EMIB, technology would let a 22nm chip connect to a 10nm chip and a 14nm chip, all on the same processor.

“For example, we can mix high-performance blocks of silicon and IP together with low-power elements made from different nodes for extreme optimization,” said Intel’s Murthy Renduchintala, who heads the Client, IoT, and Systems Architecture Group.

That’s a radical departure from how the company has constructed most CPUs and SoCs, where all components of a CPU or SoC are built on the same process. 

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